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Low-voltage-triggered silicon-controlled rectifier (LVTSCR) is expected to provide an electrostatic discharge (ESD) protection for a low-voltage integrated circuit. However, it is normally vulnerable to the latch-up effect due to its extremely low holding voltage. In this paper, a novel LVTSCR embedded with an extra p-type MOSFET called EP-LVTSCR has been proposed and verified in a 28-nm CMOS technology. The proposed device possesses a lower trigger voltage of ~ 6.2 V and a significantly higher holding voltage of ~ 5.5 V with only 23% degradation of the failure current under the transmission line pulse test. It is also shown that the EP-LVTSCR operates with a lower turn-on resistance of ~ 1.8 Ω as well as a reliable leakage current of ~ 1.8 nA measured at 3.63 V, making it suitable for ESD protections in 2.5 V/3.3 V CMOS processes. Moreover, the triggering mechanism and conduction characteristics of the proposed device were explored and demonstrated with TCAD simulation.
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http://dx.doi.org/10.1186/s11671-020-03437-3 | DOI Listing |
Nanotechnology
September 2025
Xidian University, No. 2 Taibai South Road, Electronic City Street, Xian, 710071, CHINA.
A novel P-type Buried Layer Diode-Triggered Silicon-Controlled Rectifier (PBL-DTSCR) with predicted good performance in electrostatic discharge (ESD) protection is proposed in this work. With P-type ESD implantations and silicide blocking layers applied to this novel structure, the efficiency of the diode triggering path is greatly improved, thus enhancing the discharge efficiency of the main path. Moreover, the parasitic SCR path is minimized by replacing the PNPN structure in conventional DTSCR to PNPNPN structure in PBL-DTSCR.
View Article and Find Full Text PDFMicromachines (Basel)
July 2025
School of Microelectronics, Xidian University, Xi'an 710126, China.
This paper introduces a 0.5-5.8 GHz low-noise amplifier (LNA) incorporating a gyrator-C-based active inductor (AI) and an enhanced deep trench isolation (DTI) electrostatic discharge (ESD) diode.
View Article and Find Full Text PDFInt J Biol Macromol
September 2025
School of Materials Science and Engineering, Zhengzhou University, Zhengzhou 450001, China; Henan International Joint Laboratory of Biomass Resources and Materials, Zhengzhou University, Zhengzhou 450001, China. Electronic address:
Designing a material that can serve as both a submucosal injectable material (SIM) and a wound treatment agent is highly desirable for achieving optimal outcomes in endoscopic submucosal dissection (ESD), yet it remains a significant challenge. In this study, a series of injectable multifunctional microparticles were developed as SIMs to achieve rapid hemostasis and wound repair after ESD. To enhance the biofunctional properties of these microparticles, sodium alginate (SA) was modified through serotonin and cysteine grafting.
View Article and Find Full Text PDFSci Rep
August 2025
School of Electronic and Information Engineering, Lanzhou Jiaotong University, Lanzhou, 730070, China.
In order to improve the performances of 4 two-input NAND so that it can be better used in the aerospace application field and in harsh environments, 4 two-input NAND gate chips were designed and successfully fabricated in this paper, based on 1.2 [Formula: see text]m P-well SPDM CMOS technological processes. The N transistors were fabricated in P-well and connected to GND via [Formula: see text]-well.
View Article and Find Full Text PDFSci Rep
July 2025
Department of Internal Medicine, Hallym University Dongtan Sacred Heart Hospital, Hallym University College of Medicine, Hwaseong-si, Korea.
Currently, no consensus exists on optimal treatment for post-endoscopic submucosal dissection (ESD) gastric ulcer. This study aims to compare rebamipide and tegoprazan combination therapy with tegoprazan monotherapy for post-ESD ulcer healing. Between May 2022 and September 2023, 140 patients (141 lesions) who underwent ESD for gastric epithelial neoplasms at five tertiary hospitals were randomly assigned to tegoprazan monotherapy or combination therapy groups.
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