Flexible dimensional control of high-capacity Li-ion-battery anodes: from 0D hollow to 3D porous germanium nanoparticle assemblies.

Adv Mater

School of Energy Engineering and Converging Research Center for Innovative Battery Technologies, Ulsan National Institute of Science & Technology, 689-798 Ulsan, Korea.

Published: January 2010


Category Ranking

98%

Total Visits

921

Avg Visit Duration

2 minutes

Citations

20

Article Abstract

Download full-text PDF

Source
http://dx.doi.org/10.1002/adma.200901846DOI Listing

Publication Analysis

Top Keywords

flexible dimensional
4
dimensional control
4
control high-capacity
4
high-capacity li-ion-battery
4
li-ion-battery anodes
4
anodes hollow
4
hollow porous
4
porous germanium
4
germanium nanoparticle
4
nanoparticle assemblies
4

Similar Publications

Rational assembly of 3D network materials and electronics through tensile buckling.

Sci Adv

September 2025

Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China.

Bioinspired network designs are widely exploited in biointegrated electronics and tissue engineering because of their high stretchability, imperfection insensitivity, high permeability, and biomimetic J-shaped stress-strain responses. However, the fabrication of three-dimensionally (3D) architected electronic devices with ordered constructions of network microstructures remains challenging. Here, we introduce the tensile buckling of stacked multilayer precursors as a unique route to 3D network materials with regularly distributed 3D microstructures.

View Article and Find Full Text PDF

Low-Dimensional Semiconducting Silver (Germanium, Tin) Polyphosphides - Incommensurately Modulated Derivates of the HgPbP Structure Type.

Inorg Chem

September 2025

Synthesis and Characterization of Innovative Materials, TUM School of Natural Sciences, Department of Chemistry, Technical University of Munich, Lichtenbergstraße 4, Garching b. München 85748, Germany.

Semiconductors with one-dimensional (1D) substructures are promising for next-generation optical and electronic devices due to their directional transport and flexibility. Representatives of this class include HgPbP-type materials. This study investigates the related semiconductors AgGeP and AgSnP.

View Article and Find Full Text PDF

Modern electronic systems are evolving toward miniaturized designs, flexible architectures, and high-power-density requirements. However, progress in developing electrical insulation materials that integrate mechanical robustness, flexibility, and thermal stability remains a critical challenge. This study introduces a novel nacre-inspired aramid-vermiculite nanopaper featuring a 3D interconnected layered network, designed for use in flexible electrical insulating applications.

View Article and Find Full Text PDF

Membrane-protein quality control in Escherichia coli involves coordinated actions of the AAA+ protease FtsH, the insertase YidC and the regulatory complex HflKC. These systems maintain proteostasis by facilitating membrane-protein insertion, folding and degradation. To gain structural insights into a putative complex formed by FtsH and YidC, we performed single-particle cryogenic electron microscopy on detergent-solubilized membrane samples, from which FtsH and YidC were purified using Ni-NTA affinity and size-exclusion chromatography.

View Article and Find Full Text PDF

Three-dimensional printing (3DP) technology enables the flexible fabrication of integrated monolithic microextraction chips for high-throughput sample pretreatment. Meanwhile, the extraction performance of 3DP-based channels is largely limited by printer resolution and the commercially available printing materials. In this work, a 3DP array monolithic microextraction chip (AMC) was fabricated by integrating 26-array helical monolithic microextraction channels for sample pretreatment and 52-array gas valves for fluid control.

View Article and Find Full Text PDF