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Photonic antennas are critical in applications such as spectroscopy, photovoltaics, optical communications, holography, and sensors. Metal antennas are widely used because of their small size, but they are difficult to be compatible with a CMOS. All-dielectric antennas are easier to integrate with Si waveguides, but are generally larger in size. In this paper, we propose the design of a small-sized, high-efficiency semicircular dielectric grating antenna. The antenna's key size is only 2.37µ×4.74µ, and the emission efficiency reaches over 64% in the wavelength range from 1.16 to 1.61 µm. The antenna provides a new, to the best of our knowledge, approach for three-dimensional optical interconnections between different decks of integrated photonic circuits.
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http://dx.doi.org/10.1364/AO.472979 | DOI Listing |
Adv Mater
August 2025
State Key Laboratory of New Ceramics and Fine Processing, Tsinghua University, Beijing, 100084, China.
The rapid development of self-powered microelectronics demands thermoelectric devices (TEDs) that can simultaneously achieve high energy conversion efficiency and silicon micro-fabrication compatibility. While for conventional bulk TEs, their incompatibility with silicon micro-manufacturing restricts microelectronic integration. 2D materials, though CMOS-fabrication-friendly and widely explored for microelectronic devices, face critical limitations in thermoelectric energy conversion efficiency due to their low zT values (<0.
View Article and Find Full Text PDFMaterials (Basel)
July 2025
Instituto de Energía Solar, ETSI de Telecomunicación, Universidad Politécnica de Madrid, 28040 Madrid, Spain.
Interest in germanium electronic devices is experiencing a comeback thanks to their suitability for a wide range of new applications, like CMOS transistors, quantum technology or infrared photonics. Among these applications, Ge-based thermophotovoltaic converters could become the backbone of thermo-electrical batteries. However, these devices are still far from the efficiency threshold needed for industrial deployment, with surface recombination as the main limiting factor for the material.
View Article and Find Full Text PDFNat Commun
August 2025
Ministry of Industry and Information Technology Key Lab of Micro-Nano Optoelectronic Information System, Harbin Institute of Technology Shenzhen, Shenzhen, 518055, PR China.
Broadband achromatic metalenses and metalens arrays hold promise for enabling high-performance optical imaging in a compact form factor. Conventional visible-light achromatic metalenses are composed of transparent and high-refractive-index TiO or GaN nanopillars, but are strongly limited in mainstream silicon-based complementary metal-oxide-semiconductor (CMOS) processes. Herein, we report the realization of high-efficiency SiN achromatic metalenses in the visible range and demonstrate their integration onto a commercial imaging chip.
View Article and Find Full Text PDFThe explosive growth of global data traffic demands broadband and high-density photonic integration. Silicon photonics, a scalable and CMOS-compatible platform, is a promising solution, but achieving broadband performance in fundamental components such as waveguide crossings remains challenging. Here, we demonstrate the silicon waveguide crossing operating efficiently across the full S + C + L bands (1460-1625 nm), achieving an unprecedented 165-nm bandwidth with insertion loss below -0.
View Article and Find Full Text PDFACS Nano
August 2025
Hunan Institute of Optoelectronic Integration and Key Laboratory for MicroNano Physics and Technology of Hunan Province, State Key Laboratory of Chemo/Biosensing and Chemometrics, College of Materials Science and Engineering, Hunan University, Changsha 410082, P. R. China.
Silicon-based optical modulators are crucial for advancing silicon photonics, particularly in optical communication and sensing applications. Thermo-optic (TO) modulation is a convenient and effective approach with a large phase modulation depth, which stands out among various techniques. However, conventional TO modulators face inherent trade-offs: metallic heaters require thick SiO isolation layers that limit thermal efficiency, while graphene-based designs incur large optical losses from transfer process-induced interfacial defects and absorption, ultimately restricting scalability in photonic integrated circuits.
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