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In consideration of low density and high intrinsic thermal conductivity, spherical graphite powders can act as promising fillers for light weight thermal interface materials. Herein, spherical artificial graphite derived composites exhibit a similar thermal conductivity and significantly reduced bulk density compared with traditional AlO-derived composites. Further, based on the particle packing theory, an innovatively optimized calculation method has been proposed by introducing the quadratic programming method into the traditional calculation method to acquire the optimum formulation of multi-scale spherical graphite particles. The thermal conductivity of the optimum formulation-derived composites attains 1.994 W m K, which is 1.72 times higher than that of the single particle size-derived composites (1.156 W m K), accompanied by a low density of 1.812 g cm the 2.31 g cm of the traditional AlO-derived composites. Besides, the relationships between the tap density of the graphite powders, thermal conductivity and maximum filling content of the composites are creatively established, which are available for predicting the thermal conductivities of composites by simply testing the tap density of the fillers. This present work provides an instructional strategy to optimize spherical filler particles for thermal management of electronic devices.
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http://dx.doi.org/10.1039/d2ra04633d | DOI Listing |
Chem Sci
September 2025
School of Resources, Environment and Materials, Guangxi Key Laboratory of Processing for Non-ferrous Metals and Featured Materials, Guangxi University Nanning 530004 P. R. China
To overcome the persistent challenges of sluggish lithium polysulfide (LiPS) conversion kinetics and the shuttle effect in Li-S batteries, this work introduces a novel, cost-effective thermal treatment strategy for synthesizing high-entropy metal phosphide catalysts using cation-bonded phosphate resins. For the first time, we successfully fabricated single-phase high-entropy FeCoNiCuMnP nanoparticles anchored on a porous carbon network (HEP/C). HEP/C demonstrates enhanced electronic conductivity and superior LiPS adsorption capability, substantially accelerating its redox kinetics.
View Article and Find Full Text PDFMed Phys
September 2025
School of Biomedical Engineering, Shanghai Jiao Tong University, Shanghai, P.R. China.
Background: In catheter-based radiofrequency ablation (RFA), energy is delivered to heterogeneous thin-walled tissues to induce therapeutic heating. Variations in electrical and mechanical properties of tissue contents have a great effect on outcomes.
Purpose: The objective of this study is to develop models that replicate tissue heterogeneity and visualize ablation zones for effective evaluation and optimization.
ACS Nano
September 2025
State Key Lab of New Ceramic Materials, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China.
SnSe is a layered semiconductor with intrinsically low thermal conductivity, making it a promising candidate for thermoelectric and thermal management applications. However, detailed measurements of the intrinsic thermal conductivity of SnSe nanosheets grown by chemical vapor deposition (CVD) remain scarce. Here, monocrystalline SnSe nanosheets were synthesized by CVD, with systematic investigation of thickness-dependent in-plane thermal conductivity.
View Article and Find Full Text PDFJ Colloid Interface Sci
August 2025
School of Chemistry and Chemical Engineering, Shandong University of Technology, Zibo 255000, PR China. Electronic address:
Li/CF primary batteries are renowned for their exceptional energy density, yet their practical deployment is hindered by the inherently sluggish kinetics of the CF cathode. This study addresses this limitation by incorporating selenium (Se) into CF (denoted as CF/Se) via a facile low-temperature thermal treatment, significantly enhancing its electrochemical performance. Comprehensive spectroscopic and electrochemical analyses reveal that Se doping induces the formation of CSe bonds, which promote semi-ionic CF bonding, thereby accelerating Li diffusion and reducing charge transfer resistance.
View Article and Find Full Text PDFACS Appl Mater Interfaces
September 2025
Chemical and Biological Engineering, University of Ottawa, 161 Louis Pasteur, Ottawa, Ontario K1N 6N5, Canada.
The processes of thermoforming 2D-printed electronics into 3D structures can introduce defects that impact the electrical performance of conductors, making them more susceptible to thermal failure during high electrical power/current applications on temperature-sensitive substrates. We therefore report the use of a thin-film boron nitride nanotube (BNNT) interlayer to directly reduce heat stress on linear and serpentine metallic traces on polycarbonate substrates thermoformed to 3D spherocylindrical geometries at varying elongation percentages. We demonstrate that the BNNT interlayer helps to improve the electrical conductivity of highly elongated thermoformed 3D traces in comparison to traces on bare polycarbonate.
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