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Flexible pressure sensors play an extremely important role in the fields of intelligent medical treatment, humanoid robots, and so on. However, the low sensitivity and the small initial capacitance still limit its application and development. At present, the method of constructing the microstructure of the dielectric layer is commonly used to improve the sensitivity of the sensor, but there are some problems, such as the complex process and inaccurate control of the microstructure. In this work, an ion composite photosensitive resin based on polyurethane acrylate and ionic liquids (ILs) was prepared. The high compatibility of the photosensitive resin and ILs was achieved by adding a chitooligosaccharide (COS) chain extender. The microstructure of the dielectric layer was optimized by digital light processing (DLP) 3D-printing. Due to the introduction of ILs to construct an electric double layer (EDL), the flexible pressure sensor exhibits a high sensitivity of 32.62 kPa, which is 12.2 times higher than that without ILs. It also has a wide range of 100 kPa and a fast response time of 51 ms. It has a good pressure response under different pressures and can realize the demonstration application of human health.
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http://dx.doi.org/10.3390/s25051348 | DOI Listing |
Dent J (Basel)
July 2025
Faculty of Dentistry, Autonomous University of Tamaulipas, Av. Universidad esq. con Blvd. Adolfo López Mateos s/n, Tampico C.P., Ciudad Victoria 89337, Mexico.
: The increasing clinical integration of 3D-printed definitive resins requires a comprehensive understanding of their physicochemical properties and adhesive behavior. However, there is limited evidence regarding the optimal surface treatment and bonding strategies for clear aligner composite attachments on these materials. This study aimed to characterize a 3D-printed definitive resin, evaluate the effects of surface treatments on its surface topography, and compare the shear bond strength (SBS) of the bonded attachments using different adhesive systems, both before and after thermocycling.
View Article and Find Full Text PDFChem Commun (Camb)
August 2025
Center for Photochemical Sciences and Department of Chemistry, Bowling Green State University, Bowling Green, OH 43403, USA.
Light-initiated norbornene vinyl addition polymerization (norbornene photo-VAP) can be achieved in a matter of seconds using a palladium precatalyst, photoacid generator (PAG) and photosensitizer (PS). This system provides high conversion and fast cure time making it suitable for light-initiated 3D printing. Photophysical studies of the system revealed insights in understanding this highly efficient formulation for high norbornene photo-VAP resins.
View Article and Find Full Text PDFA A Pract
August 2025
Department of Anesthesiology & Perioperative Medicine, Mayo Clinic, Rochester, Minnesota.
This case describes a 74-year-old woman who developed post-surgical acute respiratory distress syndrome (ARDS) after Photodynamic Bone Stabilization System (PBSS)a balloon rupture with extravasation of approximately 20 mL of monomeric resin. The ARDS likely resulted from 2 possibilities: (1) displacement of fat or tumor embolism from PBSS insertion/inflation, displacement from bioinert monomers, or orthopedic screws; or (2) chemical inflammation/pneumonitis due to intravascular dissemination of bioinert monomeric resin. Though balloon rupture and/or fat embolism is a stated manufacturer risk, (IlluminOss.
View Article and Find Full Text PDFVolumetric additive manufacturing (VAM) rapidly fabricates three-dimensional polymer structures by projecting images into a rotating vial of photosensitive resin. However, inevitable misalignment of this vial, the rotation system, and the projector limit the achievable resolution, fidelity and repeatability of VAM systems. In this work, we characterize the distinct impact of common misalignments through their distortion of a spherical test object.
View Article and Find Full Text PDFThe emerging planar photonic crystal (PC) and effective medium (EM) waveguides are considered promising technical platforms for terahertz communications. Beyond short-scale connections and various signal processing functionalities, versatile terahertz on-chip systems could be achievable by their physical integration; however, the inefficient coupling poses challenges. In this work, we propose an interface design between planar PC and EM waveguides with minimal insertion loss.
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