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Symmetry Breaking Assisted Fast Reverse Intersystem Crossing for Efficient TADF Materials.

Angew Chem Int Ed Engl

September 2025

State Key Laboratory of Luminescent Materials and Devices, Guangdong Provincial Key Laboratory of Luminescence from Molecular Aggregates, South China University of Technology, Guangzhou, 510640, China.

Reverse intersystem crossing (RISC) process is critical for thermally activated delayed fluorescence (TADF) materials to realize spin-flip of triplet excitons in organic light-emitting diodes (OLEDs), but the RISC processes of most TADF materials are not fast enough, undermining electroluminescence (EL) efficiency stability and operational lifetime. Herein, a symmetry breaking strategy to accelerate RISC processes is proposed. By designing asymmetric electron-withdrawing backbone consisting of benzonitrile and xanthone/thioxanthone groups, two new asymmetric TADF molecules, 4tCzCN-pXT and 4tCzCN-pTXT, with multiple 3,6-di-tert-butylcarbazole donors are successfully developed.

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Reversible Manipulations of Triangular-Shaped Mirror Twin Boundary Loops in Ultrathin NiTe.

Nano Lett

September 2025

School of Materials Science and Engineering, Peking University, Beijing 100871, People's Republic of China.

High-density mirror twin boundaries (MTBs) embedded in two-dimensional (2D) transition metal dichalcogenides (TMDCs) have emerged as fascinating platforms for exploring charge density wave and Tomonaga-Luttinger liquid-related issues. However, the reversible manipulation of high-density MTBs in 2D TMDCs remains challenging. Herein, we report the first fabrication of high-density MTB loops in ultrathin 1T-NiTe on the SrTiO(001) substrate, by postannealing as-grown 1T-NiTe under Te-deficient conditions.

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In recent years Quantum Computing prominently entered in the field of Computational Chemistry, importing and transforming computational methods and ideas originally developed within other disciplines, such as Physics, Mathematics and Computer Science into algorithms able to estimate quantum properties of atoms and molecules on present and future quantum devices. An important role in this contamination process is attributed to Quantum Information techniques, having the 2-fold role of contributing to the analysis of electron correlation and entanglements and guiding the construction of wave function variational ansatzes for the Variational Quantum Eigensolver technique. This paper introduces the tool SparQ (Sparse Quantum state analysis), designed to efficiently compute fundamental quantum information theory observables on post-Hartree-Fock wave functions sparse in their definition space.

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Immunoelectron microscopy: a comprehensive guide from sample preparation to high-resolution imaging.

Discov Nano

September 2025

Department of Rehabilitation Medicine, Rehabilitation Medical Center, Key Laboratory of Rehabilitation Medicine in Sichuan Province, West China Hospital, Sichuan University, Chengdu, 610041, People's Republic of China.

Immunoelectron Microscopy (IEM) is a technique that combines specific immunolabeling with high-resolution electron microscopic imaging to achieve precise spatial localization of biomolecules at the subcellular scale (< 10 nm) by using high-electron-density markers such as colloidal gold and quantum dots. As a core tool for analyzing the distribution of proteins, organelle interactions, and localization of disease pathology markers, it has irreplaceable value, especially in synapse research, pathogen-host interaction mechanism, and tumor microenvironment analysis. According to the differences in labeling sequence and sample processing, the IEM technology system can be divided into two categories: the first is pre-embedding labeling, which optimizes the labeling efficiency through the pre-exposure of antigenic epitopes and is especially suitable for the detection of low-abundance and sensitive antigens; the second is post-embedding labeling, which relies on the low-temperature resin embedding (e.

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The processes of thermoforming 2D-printed electronics into 3D structures can introduce defects that impact the electrical performance of conductors, making them more susceptible to thermal failure during high electrical power/current applications on temperature-sensitive substrates. We therefore report the use of a thin-film boron nitride nanotube (BNNT) interlayer to directly reduce heat stress on linear and serpentine metallic traces on polycarbonate substrates thermoformed to 3D spherocylindrical geometries at varying elongation percentages. We demonstrate that the BNNT interlayer helps to improve the electrical conductivity of highly elongated thermoformed 3D traces in comparison to traces on bare polycarbonate.

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