Category Ranking

98%

Total Visits

921

Avg Visit Duration

2 minutes

Citations

20

Article Abstract

Copper nanowire (CuNW) conductors have been considered to have a promising perspective in the area of stretchable electronics due to the low price and high conductivity. However, the fabrication of CuNW conductors suffers from harsh conditions, such as high temperature, reducing atmosphere, and time-consuming transfer step. Here, a simple and rapid one-step photonic sintering technique was developed to fabricate stretchable CuNW conductors on polyurethane (PU) at room temperature in air environment. It was observed that CuNWs were instantaneously deoxidized, welded and simultaneously embedded into the soft surface of PU through the one-step photonic sintering technique, after which highly conductive network and strong adhesion between CuNWs and PU substrates were achieved. The CuNW/PU conductor with sheet resistance of 22.1 Ohm/sq and transmittance of 78% was achieved by the one-step photonic sintering technique within only 20 μs in air. Besides, the CuNW/PU conductor could remain a low sheet resistance even after 1000 cycles of stretching/releasing under 10% strain. Two flexible electronic devices, wearable sensor and glove-shaped heater, were fabricated using the stretchable CuNW/PU conductor, demonstrating that our CuNW/PU conductor could be integrated into various wearable electronic devices for applications in food, clothes, and medical supplies fields.

Download full-text PDF

Source
http://dx.doi.org/10.1021/acsami.5b10802DOI Listing

Publication Analysis

Top Keywords

photonic sintering
16
sintering technique
16
cunw/pu conductor
16
cunw conductors
12
one-step photonic
12
copper nanowire
8
sheet resistance
8
electronic devices
8
one-step
4
one-step fabrication
4

Similar Publications

Ultralow Shrinkage 3D Transparent Nanoporous Glass Printing through Low-Temperature Sintering for Micro-Optical Applications.

ACS Nano

August 2025

CAS Key Laboratory of Mechanical Behavior and Design of Materials, Key Laboratory of Precision Scientific Instrumentation of Anhui Higher Education Institutes, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei 230027, China.

Current glass additive manufacturing relies on high-temperature processing to achieve optical transparency accompanied by significant structural shrinkage. These factors significantly restrict the micro-optical applications of three-dimensional (3D) glass microstructures in microsystems. Here, a low-temperature, low-shrinkage 3D printing strategy for transparent nanoporous glass microstructures is presented using a molecular cross-linker-free resin containing methacrylic acid-functionalized nanoparticles (MAA-NPs).

View Article and Find Full Text PDF

High-energy density materials are essential for the advancement of next-generation lithium-ion batteries, which power a wide range of applications from portable electronics to electric vehicles. Among them, high-Nickel (Ni) layered oxide cathodes have emerged as promising candidates due to their high capacity and cost-effectiveness. However, pores and excessive grain growth in high-Ni layered oxides compromise energy density and mechanical integrity, while oversized grains hinder lithium-ion diffusion kinetics, necessitating a sintering strategy that promotes densification without inducing abnormal grain growth.

View Article and Find Full Text PDF

High-Precision 3D Doping of Fused Silica Glass Derived from Nanocomposites.

Adv Mater

August 2025

Laboratory of Process Engineering, NeptunLab, Department of Microsystems Engineering (IMTEK), University of Freiburg, 79110, Freiburg, Germany.

Glasses are utilized for their outstanding optical, mechanical, and thermal properties. However, conventional production methods mostly yield in glasses with uniform compositions and material properties. Here a novel lithographic approach is presented for high-resolution 3D dopant integration at defined positions, which enables property modifications in specific regions.

View Article and Find Full Text PDF

Continuous reuse of polyamide 12 in powder bed fusion.

Sci Rep

July 2025

Faculty of Electronics, Photonics and Microsystems, Department of Field Theory, Electronic Circuits and Optoelectronics, Wrocław University of Science and Technology, Wyb. Wyspiańskiego 27, 50-370, Wrocław, Poland.

The thermal degradation of polymers in powder bed fusion (PBF) is one of the major issues preventing wider adoption of this technology at the production scale. Although standard PBF allows for elastic production of complex parts in a single-step manufacturing process, it is materially inefficient. This is because only approximately 10% of the material is used to develop parts, while the majority of semicrystalline polyamide 12 (PA12) remain unused.

View Article and Find Full Text PDF

We aim to elucidate the time scale over which welding between ultrahigh molecular weight polyethylene (UHMWPE) grains occurs by monitoring the dynamics of iron nanoparticles located at their interfaces, using X-ray photon correlation spectroscopy (XPCS). Within just one min above the melting point, we observe abnormally fast nanoparticle dynamics that emphasize the rapidity of the sintering mechanism, being key for the processing of long-chains polymers, as compared to the much slower chains re-entanglement shown by Yang et al. (, , (), 8779-8792), resulting in UHMWPE thermodynamic equilibrium.

View Article and Find Full Text PDF