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A method has been developed based on an on-line isotope dilution technique couple with laser ablation/inductively coupled plasma mass spectrometry (LA-ICP-MS), for the determination of boron in p-type silicon wafers. The laser-ablated sample aerosol was mixed on-line with an enriched boron aerosol supplied continuously using a conventional nebulization system. Upon mixing the two aerosol streams, the isotope ratio of boron changed rapidly and was then recorded by the ICP-MS system for subsequent quantification based on the isotope dilution principle. As an on-line solid analysis method, this system accurately quantifies boron concentrations in silicon wafers without the need for an internal or external solid reference standard material. Using this on-line isotope dilution technique, the limit of detection for boron in silicon wafers is 2.8x10(15)atomscm(-3). The analytical results obtained using this on-line methodology agree well with those obtained using wet chemical digestion methods for the analysis of p-type silicon wafers containing boron concentrations ranging from 1.0x10(16) to 9.6x10(18)atomscm(-3).
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http://dx.doi.org/10.1016/j.talanta.2009.09.013 | DOI Listing |
Sci Prog
September 2025
School of Mechanical and Automotive Engineering, Shanghai University of Engineering Science, Shanghai, China.
To address the growing demand for temperature control precision and uniformity in wafer processing, a specialized electrostatic chuck temperature control system based on thermal control coatings is proposed, aiming to enhance thermal management robustness and homogeneity. This study employs a zoned control methodology using metal-oxide conductive coatings on silicon carbide wafer heating plates. A quadrant-based thermal control coating model was established, and finite element analysis was conducted to compare temperature distribution characteristics across three geometric configurations: sectorial, spiral, and zoned designs.
View Article and Find Full Text PDFACS Appl Mater Interfaces
September 2025
Nanoelectronics Graphene and 2D Materials Laboratory, CITIC-UGR, Department of Electronics, University of Granada, Granada 18014, Spain.
The relentless scaling of semiconductor technology demands materials beyond silicon to sustain performance improvements. Transition metal dichalcogenides (TMDs), particularly MoS, offer excellent electronic properties; however, achieving scalable and CMOS-compatible fabrication remains a critical challenge. Here, we demonstrate a scalable and BEOL-compatible approach for the direct wafer-scale growth of MoS devices using plasma-enhanced atomic layer deposition (PE-ALD) at temperatures below 450 °C, fully compliant with CMOS thermal budgets.
View Article and Find Full Text PDFChem
July 2025
Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, PA 19104, USA.
The selective reduction of to formate using molecular catalysts immobilized on high surface area porous silicon is described. Manganese complexes of the form (bpy)Mn(CO)Br (bpy = 2,2'-bipyridine) were prepared with silatrane groups on the bpy ligand for attachment to oxide-coated porous silicon (SiO-porSi). SiO-porSi wafers were formed by heating hydrogen-terminated p-type porous silicon wafers under air and the manganese complexes were immobilized on SiO-porSi by heating at 80 °C.
View Article and Find Full Text PDFNat Commun
August 2025
State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, School of Microelectronics, Fudan University, Shanghai, 200433, China.
Recently, ambipolar semiconductor devices have excelled in developing programmable photodiodes for brain-inspired image sensors, offering energy, speed, and security gains. However, the lack of mature processing techniques makes their manufacture challenging, and the often-adopted Schottky contacts limit their performance. Although CMOS technology is successful in integrated circuits, the employed ohmic contacts can only transport one type of carriers, failing to meet the requirement of electrons and holes working simultaneously in ambipolar devices.
View Article and Find Full Text PDFMicromachines (Basel)
August 2025
Institute of Electronic, Microelectronic and Nanotechnology (IEMN), The University of Lille, F-59000 Lille, France.
This study examines the performance of a GaN HEMT with a 150 nm gate length, fabricated on silicon carbide, across various operational modes, including direct current (DC), radio frequency (RF), and small-signal parameters. The evaluation of DC, RF, and small-signal performance under diverse bias conditions remains a relatively unexplored area of study for this specific technology. The DC characteristics revealed relatively little I at zero gate and drain voltages, and the current grew as V increased.
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