98%
921
2 minutes
20
A novel 2-transistor (2T) pixel EUV detector is proposed and demonstrated by advanced CMOS technology. The proposed 2T detector also exhibits high spectral range (< 267 nm) and spatial resolution (67 μm) with high stability and CMOS Compatibility. The compact 2T EUV detector pixels arranged in a test array are capable of on-wafer recording the 2D EUV flux distribution without any external power. The compact 2T EUV detector pixels arranged in a test array are capable of on-wafer recording the 2D EUV flux distribution without any external power. Through proper initialization process, EUV induced discharging mechanism is fully investigated and an EUV induced electron emission efficiency model is established. Finally, a 2D array for in-situ EUV detection is demonstrated to precisely reflect the pattern projected on the chip/wafer surface.
Download full-text PDF |
Source |
---|---|
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC10281913 | PMC |
http://dx.doi.org/10.1186/s11671-023-03836-2 | DOI Listing |
ACS Appl Mater Interfaces
September 2025
Nanoelectronics Graphene and 2D Materials Laboratory, CITIC-UGR, Department of Electronics, University of Granada, Granada 18014, Spain.
The relentless scaling of semiconductor technology demands materials beyond silicon to sustain performance improvements. Transition metal dichalcogenides (TMDs), particularly MoS, offer excellent electronic properties; however, achieving scalable and CMOS-compatible fabrication remains a critical challenge. Here, we demonstrate a scalable and BEOL-compatible approach for the direct wafer-scale growth of MoS devices using plasma-enhanced atomic layer deposition (PE-ALD) at temperatures below 450 °C, fully compliant with CMOS thermal budgets.
View Article and Find Full Text PDFRev Sci Instrum
September 2025
National Synchrotron Radiation Research Center, Hsinchu 30076, Taiwan.
In this work, we developed a vacuum-compatible long trace profiler (LTP) for in situ metrology of ultra-precise x-ray optics within synchrotron vacuum chambers. Although traditional LTPs operate ex situ under atmospheric pressure, earlier optical setups-such as that by Qian et al.-performed in situ distortion measurements by directing laser beams through vacuum viewports.
View Article and Find Full Text PDFNano Lett
September 2025
Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States of America.
Wurtzite nitride ferroelectric materials have emerged as promising candidates for next-generation memory applications, due to their exceptional polarization properties and compatibility with conventional semiconductor processing techniques. Here, we demonstrate the first successful areal scaling of aluminum scandium nitride (AlScN) ferroelectric diode (FeDiode) memory down to device diameter of 40 nm while maintaining an ON/OFF ratio of >60. Using a 20-nm-thick AlScN ferroelectric layer, we evaluate both metal-insulator-ferroelectric-metal (MIFM) and metal-ferroelectric-metal (MFM) architectures for scaled resistive memory devices.
View Article and Find Full Text PDFAdv Mater
August 2025
Department of Electrical and Computer Engineering, National University of Singapore, Singapore, 117583, Singapore.
Magnetic tunnel junctions (MTJs) play a crucial role in spintronic applications, particularly data storage and sensors. Especially as a non-volatile memory, MTJs has received substantial attention due to its CMOS compatibility, low power consumption, fast switching speed, and high endurance. In parallel, bio-resorbable electronics have emerged as a promising solution for systems requiring temporary operation and secure data disposal, especially in military, intelligence, and biomedical systems where devices must safely disintegrate under physiological conditions.
View Article and Find Full Text PDFNat Commun
August 2025
State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, School of Microelectronics, Fudan University, Shanghai, 200433, China.
Recently, ambipolar semiconductor devices have excelled in developing programmable photodiodes for brain-inspired image sensors, offering energy, speed, and security gains. However, the lack of mature processing techniques makes their manufacture challenging, and the often-adopted Schottky contacts limit their performance. Although CMOS technology is successful in integrated circuits, the employed ohmic contacts can only transport one type of carriers, failing to meet the requirement of electrons and holes working simultaneously in ambipolar devices.
View Article and Find Full Text PDF