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Bismuth telluride-based alloys possess the highest efficiencies for the low-temperature-range (<500 K) applications among thermoelectric materials. Despite significant advances in the efficiency of p-type BiTe-based materials through engineering the electronic band structure by convergence of multiple bands, the ntype pair still suffers from poor efficiency due to a lower number of electron pockets near the conduction band edge than the valence band. To overcome the persistent low efficiency of n-type BiTe-based materials, we have fabricated multiphase pseudobinary BiTe-BiS compounds to take advantages of phonon scattering and energy filtering at interfaces, enhancing the efficiency of these materials. The energy barrier generated at the interface of the secondary phase of BiTeS in the BiTe matrix resulted in a higher Seebeck coefficient and consequently a higher power factor in multiphase compounds than the single-phase alloys. This effect was combined with low thermal conductivity achieved through phonon scattering at the interfaces of finely structured multiphase compounds and resulted in a relatively high thermoelectric figure of merit of ∼0.7 over the 300-550 K temperature range for the multiphase sample of n-type BiTeS, double the efficiency of single-phase BiTe. Our results inform an alternative alloy design to enhance the performance of thermoelectric materials.
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http://dx.doi.org/10.1021/acsami.3c01956 | DOI Listing |
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September 2025
School of Materials Science and Engineering, Beihang University, Beijing, 100191, China.
Thermoelectric technology has significant applications in waste heat harvesting and temperature control of electronic devices. PbS has long been seen as a robust candidate for large-scale thermoelectric applications due to its low cost and high mechanical strength. However, the low ZT near room temperature hinders its further application.
View Article and Find Full Text PDFSci Adv
September 2025
Department of Physics, State Key Laboratory of Quantum Functional Materials, and Guangdong Basic Research Center of Excellence for Quantum Science, Southern University of Science and Technology, Shenzhen 518055, China.
Here, we demonstrate unconventional scalable and sustainable manufacturing of flexible n-type BiTe films via physical vapor deposition and homo-layer fusion engineering. The achieved ultrahigh power factor of up to 30.0 microwatts per centimeter per square kelvin and ultralow lattice thermal conductivity of 0.
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September 2025
Key Laboratory of Solidification Control and Digital Preparation Technology (Liaoning Province), School of Materials Science and Engineering, Dalian University of Technology, Dalian, 116024, China.
AgSbSe is regarded as a promising p-type I-V-VI thermoelectric material owing to the intrinsically low thermal conductivity and high Seebeck coefficient. However, the intrinsic low electrical conductivity impedes the further enhancement of the thermoelectric performance of AgSbSe. Here, a novel approach is initiated to enhance the thermoelectric properties of AgSbSe by combining atomic off-centering with grain boundary engineering.
View Article and Find Full Text PDFSci Technol Adv Mater
June 2025
Institute of Solid State Physics, TU Wien, Wien, Austria.
Full-Heusler compounds represent a rich and diverse class of functional materials, covering a large compositional phase space. Representatives with 24 valence electrons are commonly semimetals or narrow-gap semiconductors as per the Slater-Pauling rule and are thus considered as thermoelectric materials, especially for room-temperature applications. Research on the archetypal thermoelectric full-Heusler compound FeVAl began over two decades ago, and since then, significant progress has been made in enhancing its thermoelectric performance.
View Article and Find Full Text PDFNanoscale
September 2025
Department of Mechanical Engineering, College of Design and Engineering, National University of Singapore, 117575, Singapore.
Organic semiconductors are widely used in flexible electronics, optoelectronic devices, and thermoelectric systems. Among them, copper hexadecafluorophthalocyanine (FCuPc), an n-type organic semiconductor, exhibits excellent chemical and thermal stability, making it suitable for a range of device applications. As device architectures scale down to the nanoscale, understanding the intrinsic thermal transport properties of such materials becomes critical for effective thermal management.
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