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In this article, Molecular Dynamics (MD) simulation is used to investigate the tensile mechanical properties of functional graded Ni-Al (NiAl) alloy with Ni coating. The grading profile, temperature, crystallographic direction, and concentration of vacancy defects have been varied and corresponding changes in the tensile properties are reported. In general, it has been revealed that functional grading may reduce the ultimate tensile strength (UTS) of this homogeneous alloy but increase Young's modulus (YM). Furthermore, MD simulations suggest that elliptically graded Ni-Al alloy has the highest UTS at low temperature while at high temperature, the largest UTS is recorded for the parabolic grading. Besides, at any temperature, the parabolically graded Ni-Al alloy shows the largest YM, followed by linear grading and elliptical grading. Moreover, it is also observed that the [111] crystallographic direction for this alloy demonstrates the highest UTS and YM. At extremely low temperatures, lattice mismatch is also observed to exert a significant impact on the failure characteristics of functional graded Ni-Al alloys. This investigation also suggests that the vacancy defects introduced removing either Al or Ni atoms degrades the UTS and YM of FGM alloys remarkably. Besides, it is also found that the UTS and YM of Ni-Al FGM alloys are very sensitive to Ni vacancies compared to Al vacancies. Parabolic grading demonstrates more resilience against vacancy defects, followed by linear and elliptical grading. This paper provides a comprehensive understanding of the mechanical properties of Ni-Al FGM alloys at the atomic level as a potential substitute for homogeneous alloys.
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http://dx.doi.org/10.1039/d1ra04571g | DOI Listing |
Materials (Basel)
June 2024
Faculty of Non-Ferrous Metals, AGH University of Krakow, 30-059 Krakow, Poland.
The continuous industrial development that occurs worldwide generates the need to develop new materials with increasingly higher functional properties. This need also applies to the basic material for electricity purposes, which is copper. In this article, we carry out studies on the influence of various alloying elements such as Mg, In, Si, Nb, Hf, Sb, Ni, Al, Fe, Zr, Cr, Zn, P, Ag, Sc, Pb, Sn, Co, Ti, Mn, Te and Bi on the electrical and mechanical properties of ETP-grade copper.
View Article and Find Full Text PDFRSC Adv
September 2021
Department of Mechanical Engineering, Bangladesh University of Engineering and Technology Dhaka-1000 Bangladesh
In this article, Molecular Dynamics (MD) simulation is used to investigate the tensile mechanical properties of functional graded Ni-Al (NiAl) alloy with Ni coating. The grading profile, temperature, crystallographic direction, and concentration of vacancy defects have been varied and corresponding changes in the tensile properties are reported. In general, it has been revealed that functional grading may reduce the ultimate tensile strength (UTS) of this homogeneous alloy but increase Young's modulus (YM).
View Article and Find Full Text PDFChemosphere
January 2022
Department of Chemical Engineering, Indian Institute of Technology Roorkee, Roorkee, Uttarakhand, 247667, India. Electronic address:
The present study investigated the effects of metal loaded spent adsorbent as catalyst for the catalytic pyrolysis of pine needle biomass. Metal active sites (Ni, Fe, Cu, Zn and Mo) were introduced in alumina matrix by wet impregnation process. Non-catalytic and catalytic semi-batch pyrolysis study was carried out at conditions: 550 °C temperature, 50 °C min heating rate and 200 mL min N flow rate.
View Article and Find Full Text PDFWaste Manag
March 2009
Minerals and Materials Processing Division, Korea Institute of Geoscience and Mineral Resources (KIGAM), 30 Gajeong-dong, Yuseong-gu, Daejeon 305-350, Republic of Korea.
Printed circuit boards incorporated in most electrical and electronic equipment contain valuable metals such as Cu, Ni, Au, Ag, Pd, Fe, Sn, and Pb. In order to employ a hydrometallurgical route for the recycling of valuable metals from printed circuit boards, a mechanical pre-treatment step is needed. In this study, the metallic components from waste printed circuit boards have been enriched using a mechanical separation process.
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