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Article Abstract
The application of low-dimensional materials for heat dissipation requires a comprehensive understanding of thermal transport at cross-interfaces, which widely exist in various composite materials and electronic devices. In this work, an analytical model is proposed, named as the cross-interface model (CIM), to accurately reveal the essential mechanism of the two-dimensional thermal transport at cross-interfaces. The applicability of CIM is validated through a comparison of the analytical results with molecular dynamics simulations for a typical cross-interface between two overlapped boron nitride nanoribbons. Besides, it is found that both the thermal resistances and the factor, η, has an important influence on the thermal transport. These investigations would deepen the understanding of the thermal transport at cross-interfaces and also facilitate the application of low-dimensional materials in thermal management.
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