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Electromigration has evolved from an important cause of failure in electronic devices to an appealing method, capable of modifying the material properties and geometry of nanodevices. Although this technique has been successfully used by researchers to investigate low dimensional systems and nanoscale objects, its low controllability remains a serious limitation. This is in part due to the inherent stochastic nature of the process, but also due to the inappropriate identification of the relevant control parameters. In this study, we identify a suitable process variable and propose a novel control algorithm that enhances the controllability and, at the same time, minimizes the intervention of an operator. As a consequence, the algorithm facilitates the application of electromigration to systems that require exceptional control of, for example, the width of a narrow junction. It is demonstrated that the electromigration rate can be stabilized on pre-set values, which eventually defines the final geometry of the electromigrated structures.
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http://dx.doi.org/10.1063/1.5011953 | DOI Listing |
ACS Nano
April 2025
Interdisciplinary Nanoscience Center (iNANO), Aarhus University, Aarhus 8000, Denmark.
Nanopipettes are important tools across diverse disciplines, including biology, physics, and materials science. Precisely controlling their characteristics is crucial for many applications. Recent progress in this endeavor has involved using the asymmetric-conductivity configuration with different electrolyte solutions inside and outside the nanopipette, which can greatly improve nanopipette sensing.
View Article and Find Full Text PDFNanoscale
October 2024
Chemistry & Physics of Materials Unit, Jawaharlal Nehru Centre for Advanced Scientific Research, Jakkur P. O., Bangalore-560064, India.
Materials (Basel)
July 2024
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116000, China.
As the integration of chips in 3D integrated circuits (ICs) increases and the size of micro-bumps reduces, issues with the reliability of service due to electromigration and thermomigration are becoming more prevalent. In the practical application of solder joints, an increase in the grain size of intermetallic compounds (IMCs) has been observed during the reflow process. This phenomenon results in an increased thickness of the IMC layer, accompanied by a proportional increase in the volume of the IMC layer within the joint.
View Article and Find Full Text PDFEnviron Sci Technol
August 2024
Key Laboratory of Materials Physics, Centre for Environmental and Energy Nanomaterials, Anhui Key Laboratory of Nanomaterials and Nanotechnology, Institute of Solid State Physics, Hefei Institutes of Physical Science, Chinese Academy of Sciences, Hefei 230031, P. R. China.
In this study, we investigate how temperature variations, a key environmental factor, affect the charge transfer process in FCDI systems across seasonal variation and geographical distributions, which is crucial for optimizing FCDI performance but has not received adequate attention. Therefore, thermal-assisted FCDI systems were proposed by controlling the temperatures of the flow electrode and saline water to simulate the environmental conditions, and the temperature effects on the charge transport and desalting ability of FCDI were investigated. First, the isothermal mode was performed, where the flow electrode and saline water were controlled at the same temperatures (0-50 °C) to simulate the natural atmospheric temperature fluctuations and industrial circulating cooling water system.
View Article and Find Full Text PDFACS Appl Mater Interfaces
July 2024
Division of Micro and Nanosystems (MST), School of Electrical Engineering and Computer Science (EECS), KTH Royal Institute of Technology, SE-10044 Stockholm, Sweden.
Tunnel junctions have been suggested as high-throughput electronic single molecule sensors in liquids with several seminal experiments conducted using break junctions with reconfigurable gaps. For practical single molecule sensing applications, arrays of on-chip integrated fixed-gap tunnel junctions that can be built into compact systems are preferable. Fabricating nanogaps by electromigration is one of the most promising approaches to realize on-chip integrated tunnel junction sensors.
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