Chemically crosslinked flexible polymer phase change material with self-healing, self-adaptive, and shape-memory properties for thermal interface applications.

In the operation of chips and other electronic components, the inability to effectively dissipate heat to ensure high-efficiency operation has always been a problem that hinders their development. To address this issue, this paper prepares a Thermal Interface Phase Change Material (TIPCM) by melt blending paraffin wax (PW) with styrene-ethylene-butylene-styrene (SEBS) and adding dicumyl peroxide as a crosslinking agent to form and reinforce a PW-SEBS crosslinked network. TIPCM maintains its structural integrity even above the melting temperature of PW due to the chemically crosslinked SEBS network, solving the leakage problem of phase change materials.

Multifunctional Phase Change Films with High Mechanical Strength, Thermally Induced Switchable Adhesion, and Shape Recoverability for Infrared Stealth.

The application of organic solid-liquid phase change materials (PCMs) is limited for the leakage problem after phase change and high rigidity. In this work, a novel flexible solid-solid PCM (DXPCM) was synthesized using a block copolymerization process with polyethylene glycol (PEG) as the energy storage segment. The phase transition temperature (from 36.

Lipophilic Modified Hierarchical Multiporous rGO Aerogel-Based Organic Phase Change Materials for Effective Thermal Energy Storage.

In the field of thermal energy storage, organic phase change materials (PCMs) are widely used as functional materials to boost thermal applications. However, there is often a tradeoff between constructing shape-stable composite PCMs with high enthalpy value and those with low leakage rates. Here, we proposed a promising scheme to address this issue.