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Continued device scaling demands improvements in lithographic resolution, which have historically been achieved by reducing wavelength and increasing numerical aperture (NA). With 0.33 NA EUV lithography now in production, current efforts are directed toward high-NA (0.55) EUV systems, aiming to extend resolution capabilities even further for future nodes. As the next logical step beyond 0.55 NA EUV, either reducing the wavelength (<13.5 nm) or increasing the NA (NA > 0.55) presents a pathway toward further scaling. This paper discusses the opportunities and technical challenges of these approaches, evaluating their feasibility and potential impact on imaging performances.
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http://dx.doi.org/10.1021/acsami.5c11891 | DOI Listing |
ACS Appl Mater Interfaces
September 2025
Imec, Kapeldreef 75, 3001 Leuven, Belgium.
Extreme ultraviolet (EUV) lithography has revolutionized the high-volume manufacturing of nanoscale components. The use of EUV light leads to ionization-driven chemistry in the imaging materials of lithography, the photoresists. The complex interplay of ionization, generation of primary/secondary electrons, and the subsequent chemical mechanisms that lead to image formation in photoresists has been notoriously difficult to study.
View Article and Find Full Text PDFMicromachines (Basel)
July 2025
State Key Laboratory of Digital Manufacturing Equipment and Technology, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.
This review examines the design of thermal control systems for state-of-the-art deep ultraviolet (DUV) and extreme ultraviolet (EUV) projection lithography tools. The lithographic system under investigation integrates several critical subsystems along the optical transmission chain, including the light source, reticle stage, projection optics (featuring DUV refractive lenses and EUV multilayer mirrors), immersion liquid, wafer stage, and metrology systems. Under high-power irradiation conditions with concurrent thermal perturbations, the degradation of thermal stability and gradient uniformity within these subsystems significantly compromises exposure precision.
View Article and Find Full Text PDFActinic patterned mask inspection (APMI) is used to verify the quality of photomasks for EUV lithography by revealing eventual defects in the patterned mask layout. The current approach to APMI, based on conventional imaging, is expensive and challenging to scale to keep up with Moore's law. Ptychography offers a promising alternative for actinic EUV mask inspection by mitigating the need for expensive optics and providing better scalability compared to direct imaging approaches.
View Article and Find Full Text PDFHigh-numerical-aperture (NA) anamorphic extreme ultraviolet lithography (EUVL) is the next-generation technology under advanced technology nodes. The design of the illumination system requires achieving better illumination uniformity while ensuring energy efficiency. However, the traditional four-mirror structure illumination system ignores the impact of energy efficiency.
View Article and Find Full Text PDFACS Appl Mater Interfaces
August 2025
Angstrom Patterning, IMEC, Leuven 3001, Belgium.
Continued device scaling demands improvements in lithographic resolution, which have historically been achieved by reducing wavelength and increasing numerical aperture (NA). With 0.33 NA EUV lithography now in production, current efforts are directed toward high-NA (0.
View Article and Find Full Text PDF