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Current reports of thermal expansion coefficients (TEC) of two-dimensional (2D) materials show large discrepancies that span orders of magnitude. Determining the TEC of any 2D material remains difficult due to approaches involving indirect measurement of samples that are atomically thin and optically transparent. We demonstrate a methodology to address this discrepancy and directly measure TEC of nominally monolayer epitaxial WSe using four-dimensional scanning transmission electron microscopy (4D-STEM). Experimentally, WSe from metal-organic chemical vapor deposition (MOCVD) was heated through a temperature range of 18-564 °C using a barrel-style heating sample holder to observe temperature-induced structural changes without additional alterations or destruction of the sample. By combining 4D-STEM measurements with quantitative structural analysis, the thermal expansion coefficient of nominally monolayer polycrystalline epitaxial 2D WSe was determined to be (3.5 ± 0.9) × 10 K and (5.7 ± 2) × 10 K for the in- and out-of-plane TEC, respectively, and (3.6 ± 0.2) × 10 K for the unit cell volume TEC, in good agreement with historically determined values for bulk crystals.
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http://dx.doi.org/10.1021/acsnano.4c02996 | DOI Listing |
Environ Monit Assess
September 2025
Indira Gandhi Conservation Monitoring Centre, World Wide Fund-India, New Delhi, 110003, India.
Understanding the intricate relationship between land use/land cover (LULC) transformations and land surface temperature (LST) is critical for sustainable urban planning. This study investigates the spatiotemporal dynamics of LULC and LST across Delhi, India, using thermal data from Landsat 7 (2001), Landsat 5 (2011) and Landsat 8 (2021) resampled to 30-m spatial resolution, during the peak summer month of May. The study aims to target three significant aspects: (i) to analyse and present LULC-LST dynamics across Delhi, (ii) to evaluate the implications of LST effects at the district level and (iii) to predict seasonal LST trends in 2041 for North Delhi district using the seasonal auto-regressive integrated moving average (SARIMA) time series model.
View Article and Find Full Text PDFACS Appl Mater Interfaces
September 2025
Department of Mechanical & Industrial Engineering, Louisiana State University, Baton Rouge, Louisiana 70803, United States.
With the rapid advancement in autonomous vehicles, 5G and future 6G communications, medical imaging, spacecraft, and stealth fighter jets, the frequency range of electromagnetic waves continues to expand, making electromagnetic interference (EMI) shielding a critical challenge for ensuring the safe operation of equipment. Although some existing EMI shielding materials offer lightweight construction, high strength, and effective shielding, they struggle to efficiently absorb broadband electromagnetic waves and mitigate dimensional instability and thermal stress caused by temperature fluctuations. These limitations significantly reduce their service life and restrict their practical applications.
View Article and Find Full Text PDFJ Chem Phys
September 2025
Center of Materials and Nanotechnologies (CEMNAT), Faculty of Chemical Technology, University of Pardubice, nam. Cs legii 565, 530 02 Pardubice, Czech Republic.
Joint direct microscopy-calorimetry measurements of crystal growth were performed for a 60 nm amorphous Sb2S3 film deposited either on a Kapton foil or on a soda-lime glass. Calorimetric crystallization proceeded in two steps, originating either from mechanical and stress-induced defects (230-275 °C) or from homogeneously formed nuclei (255-310 °C); both processes exhibited an identical activation energy of 200 kJ mol-1. At temperatures <230 °C, a Sb2O3 crystalline phase formed along the rhombohedral Sb2S3 structure.
View Article and Find Full Text PDFACS Omega
September 2025
Materials and Manufacturing Directorate, AFRL/RXEE, Air Force Research Laboratory, Wright-Patterson AFB, Ohio 45433, United States.
This study addresses a critical limitation in direct bonded copper (DBC) materials used in power electronics by introducing a copper-zirconium (Cu/Zr) alloy interposing layer at the copper-ceramic interface. This novel design aims to mitigate mechanical stress induced by mismatched material properties, such as the coefficient of thermal expansion (CTE) and elastic modulus, during thermal cycling. The key findings of this study are (1) thermal fatigue improvement: Test samples with the Cu/Zr interface layer (Cu-Cu/Zr-AlN) three times enhanced thermal fatigue resistance, surviving 30 thermal cycles from -55 to 300 °C before delamination, while standard DBC substrates without the Cu/Zr layer failed after just 10 cycles, indicating a performance improvement with the Cu/Zr alloy, (2) durability projections: Based on the Coffin-Manson model, if the upper temperature is capped at 150 °C, the Cu-Cu/Zr-AlN substrates are projected to survive approximately 1372 cycles, underscoring their potential for long-term reliability, and (3) stress mitigation: The Cu/Zr alloy layer bridges the CTE disparity between copper and ceramic, reducing mechanical stress and improving structural integrity across a broad temperature range (-55 to 300 °C).
View Article and Find Full Text PDFRSC Adv
September 2025
State Key Laboratory of Disaster Prevention & Reduction for Power Grid Changsha China
Positive temperature coefficient (PTC) materials are pivotal for safeguarding lithium iron phosphate batteries, yet their industrial application is hindered by critical drawbacks: excessive film thickness, high internal resistance, and poor solvent sustainability. Addressing these challenges, this study innovatively develops a solvent-free thermal rolling process to fabricate an asymmetric expansion polymer film, specifically thermoplastic polyurethane (TPU) reinforced polyethylene (PE)/carbon composites, which significantly enhances the PTC effect. The core mechanism lies in the asymmetric thermal expansion of TPU and PE: this unique behavior disrupts the conductive carbon network, triggering a sharp PTC transition at around 120 °C.
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