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Article Abstract
Two-dimensional (2D) transition metal dichalcogenide (TMD) layers are highly promising as field-effect transistor (FET) channels in the atomic-scale limit. However, accomplishing this superiority in scaled-up FETs remains challenging due to their van der Waals (vdW) bonding nature with respect to conventional metal electrodes. Herein, we report a scalable approach to fabricate centimeter-scale all-2D FET arrays of platinum diselenide (PtSe) with in-plane platinum ditelluride (PtTe) edge contacts, mitigating the aforementioned challenges. We realized a reversible transition between semiconducting PtSe and metallic PtTe via a low-temperature anion exchange reaction compatible with the back-end-of-line (BEOL) processes. All-2D PtSe FETs seamlessly edge-contacted with transited metallic PtTe exhibited significant performance improvements compared to those with surface-contacted gold electrodes, e.g., an increase of carrier mobility and on/off ratio by over an order of magnitude, achieving a maximum hole mobility of ∼50.30 cm V s at room temperature. This study opens up new opportunities toward atomically thin 2D-TMD-based circuitries with extraordinary functionalities.
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