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We performed a systematic study involving simulation and experimental techniques to develop induced-junction silicon photodetectors passivated with thermally grown SiO and plasma-enhanced chemical vapor deposited (PECVD) SiN thin films that show a record high quantum efficiency. We investigated PECVD SiN passivation and optimized the film deposition conditions to minimize the recombination losses at the silicon-dielectric interface as well as optical losses. Depositions with varied process parameters were carried out on test samples, followed by measurements of minority carrier lifetime, fixed charge density, and optical absorbance and reflectance. Subsequently, the surface recombination velocity, which is the limiting factor for internal quantum deficiency (IQD), was obtained for different film depositions via 2D simulations where the measured effective lifetime, fixed charge density, and substrate parameters were used as input. The quantum deficiency of induced-junction photodiodes that would be fabricated with a surface passivation of given characteristics was then estimated using improved 3D simulation models. A batch of induced-junction photodiodes was fabricated based on the passivation optimizations performed on test samples and predictions of simulations. Photodiodes passivated with PECVD SiN film as well as with a stack of thermally grown SiO and PECVD SiN films were fabricated. The photodiodes were assembled as light-trap detector with 7-reflections and their efficiency was tested with respect to a reference Predictable Quantum Efficient Detector (PQED) of known external quantum deficiency. The preliminary measurement results show that PQEDs based on our improved photodiodes passivated with stack of SiO/SiN have negligible quantum deficiencies with IQDs down to 1 ppm within 30 ppm measurement uncertainty.
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http://dx.doi.org/10.3390/s21237807 | DOI Listing |
Opt Express
February 2025
To build a photonic integration platform that incorporates monolithically integrated light sources which require minimized loss and reflection, a micro-meter scale passive layer is needed in addition to the III-V layer. Low temperature plasma-enhanced chemical vapor deposition (PECVD) silicon nitride (SiN) is a promising candidate, owing to its back-end-of-line (BEOL) integration capabilities, along with its amorphous structure that allows the growth of defect-free thick layers. In view of the III-V layer stack, the optimized SiN waveguides are thick and in a rib formation.
View Article and Find Full Text PDFNanomaterials (Basel)
June 2025
Institute of Wide Bandgap Semiconductor Materials and Devices, Research Institute of Fudan University in Ningbo, Ningbo 315327, China.
Silicon oxynitride (SiON, hereafter denoted as SiON) thin films represent an intermediate phase between silicon dioxide (SiO) and silicon nitride (SiN). Through systematic compositional ratio adjustments, the refractive index can be precisely tuned across a wide range from 1.45 to 2.
View Article and Find Full Text PDFNanophotonics
June 2025
Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, 47907, USA.
Silicon nitride (SiN) is a key material for quantum photonics due to its wide transparency window, high refractive index, low optical losses, and semiconductor foundry compatibility. We study the formation of single-photon emitters in SiN films grown by plasma-enhanced chemical vapor deposition (PECVD), exploring their photophysical properties and dependence on growth conditions. Emitters were observed across the entire range of nitrogen-to-silicon precursor ratios, from silicon-rich to nitrogen-rich conditions, enabled by the low background fluorescence.
View Article and Find Full Text PDFACS Appl Mater Interfaces
May 2025
College of Information and Communication Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea.
As device scaling processes, widely used silicon dioxide (SiO) films in semiconductor devices face increasing challenges from interfacial defects, oxygen vacancies, and suboxide states that degrade their dielectric performance. Therefore, an effective post-treatment method is critical for enhancing their stability, reproducibility, and reliability. In this study, SiO films deposited via plasma-enhanced chemical vapor deposition (PECVD) were treated with nitric oxide (NO) plasma for durations of 0, 1, 4, and 10 min to evaluate its impact on their electrical and chemical structural properties.
View Article and Find Full Text PDFACS Appl Energy Mater
November 2024
Department of Materials, University of Oxford, Oxford OX1 3PH, U.K.
A highly efficient hole-selective passivating contact remains the crucial step required to increase the efficiency of polysilicon-based Si solar cells. The future development of solar modules depends on a device structure that can complement the electron-selective tunnel oxide passivating contact with an equivalent hole-selective contact. We investigate plasma enhanced chemical vapor deposited (PECVD) SiN and atomic layer deposited AlO as alternative nanolayers for the passivation layer in polysilicon tunnel contacts.
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