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Traditional brazing quality inspection methods find it difficult to detect brazing layer defects on heteromorphic workpieces. Thus, a non-destructive testing technology based on a thermal probe is developed in this work. Scanning thermal resistance testing and analysis are carried out for two types of workpiece samples with different structures, and an evaluation calculation method is proposed to effectively characterize the brazing effect of the workpiece. By comparison with standard workpieces, qualified brazing layer products can be selected. In addition, the feasibility of this method is verified by ANSYS thermal simulations. In comparison with the x ray, it also has shown the superiority of this method. Experimental results show that this method can effectively evaluate the brazing layer quality of workpieces with heteromorphic and complex structures, and the reliability of the workpiece is further improved.
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http://dx.doi.org/10.1063/5.0054559 | DOI Listing |
Sci Rep
July 2025
School of Mechanical and Electrical Engineering, Luo Yang Polytechnic, Luoyang, 471000, China.
This paper investigates the microstructure and mechanical properties of Sn/Cu micro solder joints with varying β-Sn orientations under thermoelectric coupling conditions. The findings indicate that in single-crystal Sn/Cu solder joints, when the angle θ between the current direction and the c-axis of the β-Sn grain is ≤ 43.5°, significant dissolution occurs in the cathode CuSn intermetallic compound (IMC) layer and the Cu substrate; large-sized CuSn IMC forms at the anode.
View Article and Find Full Text PDFMaterials (Basel)
June 2025
Science and Technology on Reactor Fuel and Materials Laboratory, Nuclear Power Institute of China, Chengdu 610213, China.
Silicon carbide (SiC) ceramics were brazed with Ni-Ti fillers at 1350 °C for 10 min. The experimental results show that with the increase in Ti content in the fillers, the interface layer composed of NiSi, NiSi, graphite, and TiC becomes thinner due to the inhibition of the Ti/SiC reaction on the Ni/SiC reaction. When Ni-45Ti filler is used, TiC becomes the only phase of the interface layer in the brazing seam.
View Article and Find Full Text PDFUltrasonics
November 2025
Key Laboratory of Pressure Systems and Safety, Ministry of Education, East China University of Science and Technology, Shanghai 200237, China.
High-temperature ultrasonic transducers (HTUTs) are critical for structural health monitoring (SHM). While many existing studies on HTUTs prioritize maximizing operational temperatures or focus on singular high-performance piezoelectric materials or robust bonding techniques like brazing for extreme conditions, this work distinguishes itself by comprehensively investigating a synergistic, multi-component system specifically optimized for stable, well-characterized performance and revealing novel interfacial phenomena within the industrially prevalent 350 °C range. We introduce a HTUT innovatively constructed using a nano-Ag coupling layer, graphite conductive glue for reliable electrical contacts, and mica high-temperature wire.
View Article and Find Full Text PDFMaterials (Basel)
April 2025
Department of Material Research, National Atomic Research Institute, Taoyuan 325, Taiwan.
This study attempts to use fly ash as the brazing filler additive to increase the sustainable use of coal-fired power plant by-product materials. The experimental results show that adding 5 wt% fly ash into the Ag paste filler contributes to the interfacial reactions in heterogeneous reactive air brazing (RAB) of the ZrO and Crofer alloy. The Ag-rich phase dominates the brazed zone.
View Article and Find Full Text PDFUltrason Sonochem
December 2024
State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, China.
The Ni mesh was incorporated into the Cu/Sn58Bi/Cu bonding as a reinforcing skeleton to achieve an enhancement effect analogous to steel reinforcement in concrete. Ultrasonic-assisted soldering (UAS) improved the metallurgical bond among the solder, Ni mesh, and substrate. It facilitated the formation of (Cu, Ni)Sn intermetallic compounds (IMCs) layers, increasing the joint strength.
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