Investigation on the Interfacial Delamination of Glass Substrate Packaging Using Cohesive Zone Models.

This study aligns with the development trend of glass substrate packaging. The research aims to analyze the delamination of the substrate-adhesive layer-chip trilayer structure in packaging through experimental testing to obtain interface strength parameters. Subsequently, an iterative process combining experiments and simulations was applied to establish a cohesive zone model characterizing crack initiation and propagation.

Ultra-compact electro-optic modulator based on alternative plasmonic material.

We propose an ultra-compact electro-optic microring modulator based on a hybrid plasmonic waveguide. In comparison to previously proposed structures, the present structure utilizes aluminum-doped zinc oxide (AZO), rather than noble metals, for plasmon excitation. AZO can be used to simultaneously tune both the real and imaginary parts of the dielectric constant by changing the carrier concentration.

Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components-A Review.

Understanding the defect characterization of electronic and mechanical components is a crucial step in diagnosing component lifetime. Technologies for determining reliability, such as thermal modeling, cohesion modeling, statistical distribution, and entropy generation analysis, have been developed widely. Defect analysis based on the irreversibility entropy generation methodology is favorable for electronic and mechanical components because the second law of thermodynamics plays a unique role in the analysis of various damage assessment problems encountered in the engineering field.