Laser Sintering by Spot and Linear Optics for Inkjet-Printed Thin-Film Conductive Silver Patterns with the Focus on Ink-Sets and Process Parameters.

The implementation of the laser sintering for inkjet-printed nanoparticles and metal organic decomposition (MOD) inks on a flexible polymeric film has been analyzed in detail. A novel approach by implementing, next to a commonly 3.2 mm diameter spot laser optic, a line laser optic with a laser beam area of 2 mm × 80 mm, demonstrates the high potential of selective laser sintering to proceed towards a fast and efficient sintering methodology in printed electronics.

Low temperature atomic layer deposition of cobalt using dicobalt hexacarbonyl-1-heptyne as precursor.

In this work, we present the development of an atomic layer deposition (ALD) process for metallic cobalt. The process operates at low temperatures using dicobalt hexacarbonyl-1-heptyne [Co(CO)HC≡CCH] and hydrogen plasma. For this precursor an ALD window in the temperature range between 50 and 110 °C was determined with a constant deposition rate of approximately 0.

Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates.

Emerging trends like the Internet of Things require an increasing number of different sensors, actuators and electronic devices. To enable new applications, such as wearables and electronic skins, flexible sensor technologies are required. However, established technologies for the fabrication of sensors and actuators, as well as the related packaging, are based on rigid substrates, i.

Impact of Non-Accelerated Aging on the Properties of Parylene C.

The polymer Parylene combines a variety of excellent properties and, hence, is an object of intensive research for packaging applications, such as the direct encapsulation of medical implants. Moreover, in the past years, an increasing interest for establishing new applications for Parylene is observed. These include the usage of Parylene as a flexible substrate, a dielectric, or a material for MEMS, e.

Solving Exact Cover Instances with Molecular-Motor-Powered Network-Based Biocomputation.

Information processing by traditional, serial electronic processors consumes an ever-increasing part of the global electricity supply. An alternative, highly energy efficient, parallel computing paradigm is network-based biocomputation (NBC). In NBC a given combinatorial problem is encoded into a nanofabricated, modular network.

Modeling the temporal evolution and stability of thin evaporating films for wafer surface processing.

The interaction of thin evaporating fluid films with solids is studied using the example of water on LiTaO (LTO). Adsorption energies are computed by ab initio density functional theory (DFT) and used to calculate the Gibbs free energy of adsorption of water on LTO. Integrating the disjoining pressure, consisting of molecular and structural components, with respect to film thickness gives an expression for the Gibbs free energy.

Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils.

Considering the demand for low temperature bonding in 3D integration and packaging of microelectronic or micromechanical components, this paper presents the development and application of an innovative inductive heating system using micro coils for rapid Cu-Sn solid-liquid interdiffusion (SLID) bonding at chip-level. The design and optimization of the micro coil as well as the analysis of the heating process were carried out by means of finite element method (FEM). The micro coil is a composite material of an aluminum nitride (AlN) carrier substrate and embedded metallic coil conductors.

Fully inkjet-printed flexible organic voltage inverters as a basic component in digital NOT gates.

In relation to conventional vacuum-based processing techniques inkjet printing enables upscaling fabrication of basic electronic elements, such as transistors and diodes. We present the fully inkjet printed flexible electronic circuits, including organic voltage inverter which can work as a NOT logic gate. For this purpose the special ink compositions were formulated to preparation of gate dielectric layer containing poly (4-vinylphenol) and of the semiconductor layer poly[2,5-(2-octyldodecyl)-3,6-diketopyrrolopyrrole-alt-5,5-(2,5-di(thien-2-yl)thieno [3,2-b]thiophene)].

Static High Voltage Actuation of Piezoelectric AlN and AlScN Based Scanning Micromirrors.

Piezoelectric micromirrors with aluminum nitride (AlN) and aluminum scandium nitride (AlScN) are presented and compared regarding their static deflection. Two chip designs with 2 × 3 mm (Design 1) and 4 × 6 mm (Design 2) footprint with 600 nm AlN or 2000 nm AlScN as piezoelectric transducer material are investigated. The chip with Design 1 and AlScN has a resonance frequency of 1.

2D Scanning Micromirror with Large Scan Angle and Monolithically Integrated Angle Sensors Based on Piezoelectric Thin Film Aluminum Nitride.

A 2D scanning micromirror with piezoelectric thin film aluminum nitride (AlN), separately used as actuator and sensor material, is presented. For endoscopic applications, such as fluorescence microscopy, the devices have a mirror plate diameter of 0.7 mm with a 4 mm chip footprint.

Wafer-level integration of self-aligned high aspect ratio silicon 3D structures using the MACE method with Au, Pd, Pt, Cu, and Ir.

The wafer-level integration of high aspect ratio silicon nanostructures is an essential part of the fabrication of nanodevices. Metal-assisted chemical etching (MACE) is a promising low-cost and high-volume technique for the generation of vertically aligned silicon nanowires. Noble metal nanoparticles were used to locally etch the silicon substrate.

Magnesium β-ketoiminates as CVD precursors for MgO formation.

The synthesis and characterization of bis(ketoiminato)magnesium(ii) complexes of composition [Mg(OCRCHCHRNCHCHX)] (X = NMe: 3a, R = R = Me; 3b, R = Me, R = Ph. X = OMe: 3c, R = R = Me) are reported. Complexes 3a-c are accessible by the reaction of C(O)RCHCHRN(H)CHCHX (X = NMe: 1a, R = R = Me; 1b, R = Me, R = Ph.