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Unlabelled: Ostwald ripening destabilizes emulsified oils with significant water solubility, such as flavor oils, essential oils, and small triacylglycerols, by increasing oil droplet size over time. This study examined how small molecule surfactant types and oil phase composition affect Ostwald ripening rates in model oil-in-water emulsions. Emulsified -decane was stabilized using two non-ionic surfactants with the different structures: polyoxyethylene (100) stearyl ether or poloxamer P407. The oil phase was varied by adding longer-chain alkanes (-tetradecane, -hexadecane, or -octadecane) to the -decane before homogenization. Although altering the oil phase composition did not change the oil-water interfacial tension, it significantly impacted initial droplet size and resistance to Ostwald ripening. Longer-chain alkanes reduced ripening rates due to a compositional ripening effect, with -hexadecane being the most effective. Poloxamer-stabilized emulsions exhibited faster droplet growth than Brij-stabilized ones, due to differences in interfacial properties. These findings are crucial for inhibiting Ostwald ripening in various industrial emulsions.
Supplementary Information: The online version contains supplementary material available at 10.1007/s10068-025-01954-4.
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http://dx.doi.org/10.1007/s10068-025-01954-4 | DOI Listing |
J Am Chem Soc
September 2025
Institut de Ciència de Materials de Barcelona, ICMAB-CSIC, carrer dels Til·lers, Cerdanyola del Vallès, 08193 Barcelona, Spain.
The functional properties of nanocrystals can be finely tuned through controlled morphology and size. However, this can be challenging for metastable nanostructures that require harsh synthesis conditions, such as high temperatures. Here, we present a method for preparing large ε-FeO nanorods that are not affected by magnetic relaxation.
View Article and Find Full Text PDFFood Sci Biotechnol
September 2025
Department of Food Science and Biotechnology, Seoul National University of Science and Technology, Seoul, 01811 Republic of Korea.
Unlabelled: Ostwald ripening destabilizes emulsified oils with significant water solubility, such as flavor oils, essential oils, and small triacylglycerols, by increasing oil droplet size over time. This study examined how small molecule surfactant types and oil phase composition affect Ostwald ripening rates in model oil-in-water emulsions. Emulsified -decane was stabilized using two non-ionic surfactants with the different structures: polyoxyethylene (100) stearyl ether or poloxamer P407.
View Article and Find Full Text PDFFood Sci Biotechnol
September 2025
Department of Food Science and Biotechnology, Seoul National University of Science and Technology, Seoul, 01811 Republic of Korea.
Unlabelled: This study examined how the ability to inhibit Ostwald ripening varies with ripening inhibitor type and how interfacial composition affects inhibitor efficiency. Emulsions were stabilized using Brij S100 and S20, which differ in ethylene oxide unit numbers, while medium-chain triglyceride (MCT) and ester gum (EG), possessing distinct molecular structures, were incorporated as ripening inhibitors. Ostwald ripening rate decreased with a higher proportion of Brij S20 at the interfacial membrane.
View Article and Find Full Text PDFSmall
September 2025
School of Physical Science and Technology, ShanghaiTech University, Shanghai, 201210, China.
Conventional semiconductor manufacturing relies on top-down lithography, which faces fundamental limitations in resolution, material versatility, and cost at the nanoscale. While bottom-up colloidal strategies offer alternative pathways, they are constrained by ligand contamination and insufficient precision for integrated circuits. Here a gas-phase synthesis and assembly platform is reported that overcomes these challenges by combining plasma-generated, stabilizer-free semiconductor nanoparticles (NPs) with electric-field-guided 3D nanoprinting.
View Article and Find Full Text PDFMaterials (Basel)
August 2025
Institute of Pioneer Semiconductor Innovation, National Yang Ming Chiao Tung University, Hsinchu 300093, Taiwan.
This study investigates the use of nanocrystalline Cu (NC-Cu) to suppress interfacial voids in low-temperature Cu-Cu bonding for 3D IC packaging. We quantitatively compared the void characteristics of electrodeposited NC-Cu (grain size ~89.3 nm) and (111)-oriented nanotwinned Cu (NT-Cu, ~621.
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