Severity: Warning
Message: file_get_contents(https://...@gmail.com&api_key=61f08fa0b96a73de8c900d749fcb997acc09&a=1): Failed to open stream: HTTP request failed! HTTP/1.1 429 Too Many Requests
Filename: helpers/my_audit_helper.php
Line Number: 197
Backtrace:
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 197
Function: file_get_contents
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 271
Function: simplexml_load_file_from_url
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 3165
Function: getPubMedXML
File: /var/www/html/application/controllers/Detail.php
Line: 597
Function: pubMedSearch_Global
File: /var/www/html/application/controllers/Detail.php
Line: 511
Function: pubMedGetRelatedKeyword
File: /var/www/html/index.php
Line: 317
Function: require_once
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Triboelectric nanogenerators (TENGs) can covert mechanical energy into electricity in a clean and sustainable manner. However, traditional TENGs are mainly limited by the low output current, and thus their practical applications are still limited. Herein, a new type of TENG is developed by using conductive materials as the triboelectric layers and electrodes simultaneously. Because of the matched density of states between the two triboelectric layers, this simply structured device reaches an open-circuit voltage of 1400 V and an ultrahigh current density of 1333 mA m when poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS) film and copper (Cu) or aluminum (Al) foil are used as the triboelectric pair. The current density increases by nearly three orders of magnitude compared with traditional TENGs. More importantly, this device can work stably in high-humidity environments, which is always a big challenge for traditional TENGs. Surprisingly, this TENG can even perform well in the presence of water droplets. This work provides a new and effective strategy for constructing high-performance TENGs, which can be used in many practical applications in the near future.
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http://dx.doi.org/10.1002/adma.202210915 | DOI Listing |