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CMOS-MEMS resonators have become a promising solution thanks to their miniaturization and on-chip integration capabilities. However, using a CMOS technology to fabricate microelectromechanical system (MEMS) devices limits the electromechanical performance otherwise achieved by specific technologies, requiring a challenging readout circuitry. This paper presents a transimpedance amplifier (TIA) fabricated using a commercial 0.35-µm CMOS technology specifically oriented to drive and sense monolithically integrated CMOS-MEMS resonators up to 50 MHz with a tunable transimpedance gain ranging from 112 dB to 121 dB. The output voltage noise is as low as 225 nV/Hz-input-referred current noise of 192 fA/Hz-at 10 MHz, and the power consumption is kept below 1-mW. In addition, the TIA amplifier exhibits an open-loop gain independent of the parasitic input capacitance-mostly associated with the MEMS layout-representing an advantage in MEMS testing compared to other alternatives such as Pierce oscillator schemes. The work presented includes the characterization of three types of MEMS resonators that have been fabricated and experimentally characterized both in open-loop and self-sustained configurations using the integrated TIA amplifier. The experimental characterization includes an accurate extraction of the electromechanical parameters for the three fabricated structures that enables an accurate MEMS-CMOS circuitry co-design.
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http://dx.doi.org/10.3390/mi12010082 | DOI Listing |
Microsyst Nanoeng
September 2022
Department of Electronic Engineering, Universitat Politècnica de Catalunya, Jordi Girona 1 i 3, Edifici C4, 08034 Barcelona, Spain.
This article presents several design techniques to fabricate micro-electro-mechanical systems (MEMS) using standard complementary metal-oxide semiconductor (CMOS) processes. They were applied to fabricate high yield CMOS-MEMS shielded Lorentz-force magnetometers (LFM). The multilayered metals and oxides of the back-end-of-line (BEOL), normally used for electronic routing, comprise the structural part of the MEMS.
View Article and Find Full Text PDFMicromachines (Basel)
November 2021
School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore.
A high-aspect-ratio three-dimensionally (3D) stacked comb structure for micromirror application is demonstrated by wafer bonding technology in CMOS-compatible processes in this work. A vertically stacked comb structure is designed to circumvent any misalignment issues that could arise from multiple wafer bonding. These out-of-plane comb drives are used for the bias actuation to achieve a larger tilt angle for micromirrors.
View Article and Find Full Text PDFLab Chip
September 2021
Electronic Systems Group (GSE-UIB), University of the Balearic Islands, 07122, Palma, Spain.
CMOS-MEMS microresonators have become excellent candidates for developing portable chemical VOC sensing systems thanks to their extremely large mass sensitivity, extraordinary miniaturization capabilities, and on-chip integration with CMOS circuitry to operate as a self-sustained oscillator. This paper presents two 4-anchored MEMS plate resonators, with a resonance frequency of 2.2 MHz and 380 kHz, fabricated together with the required circuitry using a commercial 0.
View Article and Find Full Text PDFMicromachines (Basel)
January 2021
Electronic Systems Group (GSE-UIB), University of the Balearic Islands, 07122 Palma, Spain.
CMOS-MEMS resonators have become a promising solution thanks to their miniaturization and on-chip integration capabilities. However, using a CMOS technology to fabricate microelectromechanical system (MEMS) devices limits the electromechanical performance otherwise achieved by specific technologies, requiring a challenging readout circuitry. This paper presents a transimpedance amplifier (TIA) fabricated using a commercial 0.
View Article and Find Full Text PDFSensors (Basel)
October 2020
Electronic Engineering Department, Universitat Politècnica de Catalunya, Jordi Girona 1-3, 08034 Barcelona, Spain.
This work presents the design and characterization of a resonant CMOS-MEMS pressure sensor manufactured in a standard 180 nm CMOS industry-compatible technology. The device consists of aluminum square plates attached together by means of tungsten vias integrated into the back end of line (BEOL) of the CMOS process. Three prototypes were designed and the structural characteristics were varied, particularly mass and thickness, which are directly related to the resonance frequency, quality factor, and pressure; while the same geometry at the frontal level, as well as the air gap, were maintained to allow structural comparative analysis of the structures.
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