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Recently developed flexible mechanosensors based on inorganic silicon, organic semiconductors, carbon nanotubes, graphene platelets, pressure-sensitive rubber and self-powered devices are highly sensitive and can be applied to human skin. However, the development of a multifunctional sensor satisfying the requirements of ultrahigh mechanosensitivity, flexibility and durability remains a challenge. In nature, spiders sense extremely small variations in mechanical stress using crack-shaped slit organs near their leg joints. Here we demonstrate that sensors based on nanoscale crack junctions and inspired by the geometry of a spider's slit organ can attain ultrahigh sensitivity and serve multiple purposes. The sensors are sensitive to strain (with a gauge factor of over 2,000 in the 0-2 per cent strain range) and vibration (with the ability to detect amplitudes of approximately 10 nanometres). The device is reversible, reproducible, durable and mechanically flexible, and can thus be easily mounted on human skin as an electronic multipixel array. The ultrahigh mechanosensitivity is attributed to the disconnection-reconnection process undergone by the zip-like nanoscale crack junctions under strain or vibration. The proposed theoretical model is consistent with experimental data that we report here. We also demonstrate that sensors based on nanoscale crack junctions are applicable to highly selective speech pattern recognition and the detection of physiological signals. The nanoscale crack junction-based sensory system could be useful in diverse applications requiring ultrahigh displacement sensitivity.
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http://dx.doi.org/10.1038/nature14002 | DOI Listing |
Nanoscale
September 2025
Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Innovis #08-03, Singapore 138634, Republic of Singapore.
A crack-free and residue-free transfer technique for large-area, atomically-thin 2D transition metal dichalcogenides (TMDCs) such as MoS and WS is critical for their integration into next-generation electronic devices, either as channel materials replacing silicon or as back-end-of-line (BEOL) components in 3D-integrated nano-systems on CMOS platforms. However, cracks are frequently observed during the debonding of TMDCs from their growth substrates, and polymer or metal residues are often left behind after the removal of adhesive support layers wet etching. These issues stem from excessive angular strain accumulated during debonding and the incomplete removal of support layers due to their low solubility.
View Article and Find Full Text PDFJ Dent Res
September 2025
Université Paris-Saclay, CentraleSupélec, ENS Paris-Saclay, CNRS, LMPS - Laboratoire de Mécanique Paris-Saclay, Gif-sur-Yvette, France.
Like bone, dentin exhibits a complex multiscale hierarchical structure. Dentin microstructure has been widely studied at the microscale, using direct 2-dimensional observation techniques such as optical and scanning electron microscopy. Its porous network microstructure has been recently revealed in 3 dimensions using confocal laser scanning microscopy.
View Article and Find Full Text PDFMicromachines (Basel)
August 2025
School of Mechanical and Electrical Engineering, Henan University of Technology, Zhengzhou 450001, China.
Single-crystal 4H silicon carbide (4H-SiC) is a key substrate material for third-generation semiconductor devices, where surface and subsurface integrity critically affect performance and reliability. This study systematically examined the evolution of surface morphology and subsurface damage (SSD) during nanoscratching of 4H-SiC under varying normal loads (0-100 mN) using a nanoindenter equipped with a diamond Berkovich tip. Scratch characteristics were assessed using scanning electron microscopy (SEM), while cross-sectional SSD was characterised via focused ion beam (FIB) slicing and transmission electron microscopy (TEM).
View Article and Find Full Text PDFNanomaterials (Basel)
August 2025
School of Energy, Materials and Chemical Engineering, Key Laboratory of Materials and Technologies for Advanced Batteries, Hefei University, Hefei 230601, China.
The long-term reliability of vacuum insulation panels (VIPs) is constrained by the barrier film degradation caused by micro-cracks during the flanging process. However, the correlation mechanism between process parameters and microleakage remains unclear. This study systematically investigates the impact of the number of flanging cycles on the barrier properties and insulation failure of aluminum foil composite film (AF) and metallized polyester film (MF).
View Article and Find Full Text PDFAdv Sci (Weinh)
August 2025
School of Electrical, Computer, and Energy Engineering, Arizona State University, Tempe, AZ, 85281, USA.
Electrical atomic force microscopies (AFMs) have emerged as leading metrology techniques for evaluating the quality of 2D materials. Their advantages include high-resolution electrical mapping, non-destructive measurement, and the ability to probe nanoscale defects and transport properties. Conductive AFM (C-AFM) has been particularly instrumental, enabling the direct observation of individual vacancies and vacancy clusters, voids, wrinkles, and cracks.
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