Severity: Warning
Message: file_get_contents(https://...@gmail.com&api_key=61f08fa0b96a73de8c900d749fcb997acc09&a=1): Failed to open stream: HTTP request failed! HTTP/1.1 429 Too Many Requests
Filename: helpers/my_audit_helper.php
Line Number: 197
Backtrace:
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 197
Function: file_get_contents
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 271
Function: simplexml_load_file_from_url
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 3165
Function: getPubMedXML
File: /var/www/html/application/controllers/Detail.php
Line: 597
Function: pubMedSearch_Global
File: /var/www/html/application/controllers/Detail.php
Line: 511
Function: pubMedGetRelatedKeyword
File: /var/www/html/index.php
Line: 317
Function: require_once
98%
921
2 minutes
20
A new fluorinated poly(aryl ether) with reactive benzocyclobutene groups as the side chain was successfully synthesized. This polymer showed a number-average molecular weight (Mn) of 200,000 and had good solubility and film-forming ability. After being postpolymerized at high temperature (>200 °C), the polymer film converted to a cross-linked network structure, which was insoluble in the common organic solvents. Such results suggest that the postpolymerization is an efficient way to achive the balance between the solubility and the solvent resistance of the polymer. TGA data showed that the postpolymerized polymer had a 5 wt % loss temperature at 495 °C and a residual of 61% at 1000 °C under N2. The cross-linked film also exhibited good dielectric properties with an average dielectric constant of about 2.62 in a range of frequencies from 1 to 30 MHz. With regard to the mechanical properties, the cross-linked film had hardness, Young's modulus, and bonding strength to a silicon wafer of 1.22, 8.8, and 0.89 GPa, respectively. These data imply that this new polymer may have potential applications in the electrical and microelectronics industry.
Download full-text PDF |
Source |
---|---|
http://dx.doi.org/10.1021/am506019s | DOI Listing |