1D subnanomaterials (SNMs), encompassing nanowires and nanobelts with a diameter or thickness approximate to the size of a single unit cell, possess the inherent functionality of inorganic materials, polymer-analogue properties, intrinsic order, and multilevel interactions. These distinctive characteristics establish 1D SNMs as highly processable building blocks, offering significant advantages for the fabrication of advanced materials, including polarization materials, organogels, photothermal conversion devices, fluorescent materials, stimuli-responsive platforms, and catalysis. This paper summarizes assembly methods, including self-assembly, wet-spinning, electrospinning, directional coating, freezing-casting and Langmuir-Blodgett technique, which facilitate the integration of 1D SNMs into free-standing fibers, films, and 3D assemblies without polymeric additives.
View Article and Find Full Text PDFConstructing patterned film photoanodes with economizing raw chemicals but enhancing photoelectrochemical (PEC) performance is attractive for practical applications. However, simultaneously optimizing light scattering and interfacial charge transfer through plasmonic enhancement remains challenging. Herein, we developed a novel plasmonic photoanode featuring Au grids and a nanometer-thick CdSe layer (Au grid-CdSe) with well-organized heterointerfaces, fabricated via a facile colloidal topochemical strategy.
View Article and Find Full Text PDFPlasmonic Cu@semiconductor heteronanocrystals (HNCs) have many favorable properties, but the synthesis of solid structures is often hindered by the nanoscale Kirkendall effect. Herein, we present the use of an atomically thin AuCu palisade interlayer to reduce lattice mismatch and mediate the Kirkendall effect, enabling the successive topological synthesis of Cu@AuCu@Ag, Cu@AuCu@AgS, and further transformed solid Cu@AuCu@CdS core-shell HNCs via cation exchange. The atomically thin and intact AuCu palisade interlayer effectively modulates the diffusion kinetics of Cu atoms as demonstrated by experimental and theoretical investigations and simultaneously alleviates the lattice mismatch between Cu and Ag as well as Cu and CdS.
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