Functionalization of Silver Nanowires Surface using Ag-C Bonds in a Sequential Reductive Method.

Silver nanowires (Ag-NW) assembled in interdigitated webs have shown an applicative potential as transparent and conducting electrodes. However, upon integration in practical device designs, the presence of silver oxide, which instantaneously forms on the Ag-NW surfaces in ambient conditions, is unwanted. Here, we report on the functionalization of Ag-NWs with 4-nitrophenyl moieties through A-C bonds using a versatile two step reduction process, i.

Role of silicon nanowire diameter for alkyl (chain lengths C₁-C₁₈) passivation efficiency through Si-C bonds.

The effect of silicon nanowire (Si NW) diameter on the functionalization efficiency as given by covalent Si-C bond formation is studied for two distinct examples of 25 ± 5 and 50 ± 5 nm diameters (Si NW25 and Si NW50, respectively). A two-step chlorination/alkylation process is used to connect alkyl chains of various lengths (C1-C18) to thinner and thicker Si NWs. The shorter the alkyl chain lengths, the larger the surface coverage of the two studied Si NWs.