Enhancing Interlayer Bonding in DLP-Printed Piezoelectric Ceramics via Controlled Secondary Curing for High Piezoelectric Performance.

Digital light processing (DLP) presents a promising approach for fabricating intricately designed piezoelectric components, which are essential for developing high-sensitivity piezoelectric sensor systems. However, the inherent layer-by-layer stacking nature of DLP induces interlayer cracking in printed ceramics, which severely deteriorates their performance. This work introduces an innovative interfacial engineering strategy to print superlattice components with exceptional piezoelectric performance.