Multiplex Optical Unclonable Functions: Advances and Perspectives in Optics and Photonics for Hardware Security.

With the accelerating expansion of connectivity, the need for advanced cyber-physical security technologies that bridge the digital and physical worlds is becoming more crucial than ever. Physically unclonable functions (PUFs) leveraging nanotechnologies and photonic technologies are emerging as practical and deployable hardware security solutions that go beyond software-based hardware security. Optics- and photonics-based PUFs (often referred to as optical PUFs) offer a range of characteristics beneficial to multiplex strategies that incorporate multilevel and multimodal approaches, based on their fundamental optical and photonic properties.

Exploiting Brownian Motion of Plasmonic Nanoparticles Using Optical Printing Approach for on-Demand Physical Unclonable Functions.

An on-demand fabrication method for additive physical unclonable functions (PUFs), a hardware-based security primitive, is inevitably required, especially considering increasingly miniaturized microelectronic devices. An optical printing approach is regarded as an alternative method to fabricate functional nano/microscale patterns against conventional methods due to its superior fabrication flexibility. However, owing to the Brownian motion of nanoparticles, achieving highly precise and selective printing persists an ongoing obstacle for the applicability of optical printing methods.

In Situ Synthesis of Two-Dimensional Lateral Semiconducting-Mo:Se//Metallic-Mo Junctions Using Controlled Diffusion of Se for High-Performance Large-Scaled Memristor.

Two-dimensional (2D) materials are favorable candidates for resistive memories in high-density nanoelectronics owing to their ultrathin scaling and controllable interfacial characteristics. However, high processing temperatures and difficulties in mechanical transfer are intriguing challenges associated with their implementation in large areas with crossbar architecture. A high processing temperature may damage the electrical functionalities of the bottom electrode, and mechanical transfer of 2D materials may introduce undesirable microscopic defects and macroscopic discontinuities.